Solderable Polyurethane Enamelled Round Copper Wire Overcoated with Polyamide, Class 155

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OVERALL SCORE
Specifications
Conductor:Copper
Insulation layer:single
Thermal Class:155℃
Insulation materials:None
Shape:Round
Size:0.05mm-1.6mm
Advantages
High Dielectric Strength
Moisture Resistance
Magnetic Properties
Superior Electrical Conductivity
Wide Range of Applications
Excellent Mechanical Flexibility

IEC 60317-0-21 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin.


NOTE: modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.


The range of nominal conductor diameters covered by this standard is:

Grade 1: 0,050 mm up to and including 1,600 mm;

Grade 2:0,050 mm up to and including 1,600 mm.

General Requirements

1.Winding Wire
Class 155 is a thermal class that requires a minimum temperature index of 155 and a heat shock temperature of at least 175 C.
The temperature in C corresponding to the temperature index is not necessarily that at which it is recommended that the wire be operated and this will depend on many factors, including the type of equipment involved.

2.Flexibility and adherence
The constant K used for the calculation of the number of revolutions for the peel test shall be 150 mm.

3.Heat shock
The minimum heat shock temperature shall be 175℃.

4.Cut-through
No failure shall occur within 2 min at 200 ℃.

5.Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and including 1,600 mm)

The wire shall meet the requirements given in Table 1.

For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter shall be taken.

Table 1- Resistance to abrasion

Nominal conductor diameter (mm)Grade 1Grade 2
Minimum average force to failure (N)Minimum force to failure of each measurement (N)Minimum average force to failure (N)Minimum force to failure of each measurement (N)
0,250
0,280
0,315
0,355
0,400
0,450
0,500
0,560
0,630
0,710
0,800
0,900
1,000
1,120
1,250
1,400
1,600
2,30
2,50
2,70
2,90
3,15
3,40
3,65
3,90
4,20
4.50
4,80
5,20
5,60
6,00
6,50
7.00
7,50
1,95
2,10
2,30
2,50
2,70
2,90
3,10
3,30
3,55
3,80
4,10
4,40
4,75
5,15
5,55
5,95
6,35
4,10
4,40
4,75
5,10
5,45
5,80
6,20
6,65
7,1
7,60
8,10
8,70
9,30
10,0
10,7
11,4
12,2
3,50
3,70
4,00
4,30
4,60
4,90
5,25
5,60
6,00
6,45
6,90
7,40
7,90
8,50
9,10
9,70
10,4

6.Breakdown voltage

6.1 General
The wire shall meet the requirements given in 6.2 and 6.3, respectively, when tested at room temperature and at 155 °C when this is required by the purchaser.

6.2 Nominal conductor diameters up to and including 0,100 mm

At least four of the five specimens tested shall not break down at a voltage less than or equal to that given in Table 2.

For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter shall be taken.

Table 2-Breakdown voltage

Nominal conductor diameter (mm)Minimum breakdown voltage (root-mean-square value)(r.m.s) (V)
Grade 1Grade 2
At room temperature
0,050
0,056
0,063
0,071
0,080
0,090
0,100
275
300
350
375
375
450
450
550
600
650
650
750
800
850

6.3 Nominal conductor diameters over 0,100 mm up to and including 1,600 mm

At least four of the five specimens tested shall not break down at a voltage less than or equal to that given in Table 3.

For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter shall be taken.

Table 3- Breakdown voltage

Nominal conductor diameter (mm)Minimum breakdown voltage(r.m.s) (V)
Grade 1Grade 2
Room temperature155℃Room temperature155℃
0,112
0,125
0,140
0,160
0,180
0,200
0,224
0,250
0,280
0,315
0,355
0,400
0,450
1 200
1 300
1 400
1 500
1 500
1 600
1 700
1900
2000
2000
2 100
2 100
2 100
006
1 000
1 100
1 100
1 100
1 200
1 300
1 400
1 500
1 500
1 600
1 600
1 600
2400
2 500
2700
2 900
3 000
3 100
3 300
3 500
3 600
3 700
3 900
4 000
4 000
1 800
1900
2000
2 200
2 300
2 300
2 500
2600
2700
2 800
2 900
3 000
3 000
0,500
0,560
0,630
0,710
0,800
0,900
1,000
up to andincluding 1,600
2 200
2 200
2 300
2 300
2300
2 400
2 400
1 700
1700
1700
1700
1 700
1 800
4 100
4 100
4 300
4 300
4 400
4 500
4 500
3 100
3 100
3 200
3 200
3 300
3 400
3 400

7.Temperature index
The minimum temperature index shall be 155.

8.Solderability

8.1 General
The temperature of the solder bath shall be (390 ± 5)℃. The surface of the tinned wire shall be smooth and free from holes and enamel residues.

8.2 Nominal conductor diameters up to and including 0,100 mm
The temperature of the solder bath shall be (390 ±5) °℃. The maximum immersion time shall be 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.

8.3 Nominal conductor diameters over 0,100mm
The temperature of the solder bath shall be (390 ± 5)°℃. The maximum immersion time (in seconds) shall be the following multiple of the nominal conductor diameter (in millimetres) with a minimum of 2 s.

Grade 1Grade 2
8 s/mm12 s/mm

The surface of the tinned wire shall be smooth and free from holes and enamel residues.

9. Dielectric dissipation factor
Test to be agreed between purchaser and supplier.

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